Description innovative silver-filled AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). ME8452-A can be easily reworked from 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your exact needs. ME8452-A is available in syringes for automatic needle dispensing applications or in jars. 1 cc TSI Syringe.
描述 创新的银填充 AI Technology ME8452-A是ME8452的快速版本，用于快速固化应用程序。这种创新的填充银的环氧糊状粘合剂是无溶剂的，可再加工的，并且具有导电性和导热性。具有出色的灵活性，可用于粘接与高度不匹配的CTE（即氧化铝对铝，硅对铜）的材料。 ME8452-A可以在80至100ºC的温度下轻松进行返工，并且由于其能够与高度不匹配的CTE粘合材料的能力而非常适合大面积管芯附着和基板附着等应用。粘度和触变性指数均可根据您的实际需要进行修改。 ME8452-A可用于自动针头分配应用的注射器或广口瓶中。 1 cc TSI注射器
