杜邦DuPont导体材料

 offers a complete set of conductors covering a broad application spectrum.

Designed to deliver the best reliability/performance vs. system level cost, these materials enable more cost-effective manufacturing processes, including fine line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.

The conductors allow several different interconnect strategies, ranging from 25-micron gold wirebond to heavy gauge aluminum wirebond, wedge bond, ribbon bond, ball grid array (BGA), flip chips, and more.

Additional benefits include low noise characteristics (rated up to five times better than those of conventional systems), improved post-laser trim stability (improved by a factor of three), and outstanding durability at high temperatures.

 conductive/resistive hydro-active ink 

Emerging PE-Kapton™ Inks

Emerging PE-Kapton™ inks is turning the heat up with this ink family that provides extreme Versality and Thermal Performance for applications where extremes of heat and vibration are the norm. Designers have relied on Kapton film because of its ability to maintain its unique combination of mechanical and electrical properties under the harshest of conditions. Now DuPont brings these capabilities to a line of conductive and insulating electronic inks.

DuPont offers a broad selection of hybrid circuit materials to meet the requirements of different substrates, operating environments, temperatures, and metallizations. Conductor materials from DuPont are available in a wide variety of traditional thick film compositions, including silver, gold, platinum and their alloys.

Self limiting Heaters

New Enabling Positive Temperature Coefficient (PTC) Ink Technology

Self-regulating/Self-limiting due to a large resistance increase with increasing temperature

Improved stability

No pre-conditioning needed

Wide range of compatible adhesive

Silver/Platinium Conductors

DuPont Ag/Pt conductors offer high solder leaching resistance and good soldering performances.

Gold based conductors

Gold conductors are used for high reliability applications owing to their low resisitivity, resistance to metal migration even in harse environments and non oxidation and corrodation properties.

Silver/Palladium Conductors

DuPont Silver Palladium conductors limit the silver migration in harsh envrionment and improve solderability.

Platinium conductors

DuPont Platinium conductors are suitable to operate at elevated temperatures and can be used as electrodes for sensors applications.

Additional products and information

Related products

ResistorsDielectric & EncapsulantLTCC AlN paste systemAlu, Glass & Steel paste systems

More from Hybrid circuits

Bonding wires

More from DuPont conductive paste

MTS & RFIDIntexar™ Strechable Electronics

In-Mold (IME)

杜邦提供了一套完整的导体，涵盖了广泛的应用范围。
这些材料旨在提供最佳的可靠性/性能与系统级成本，可实现更具成本效益的制造工艺，包括细线印刷、30 或 60 分钟烧制曲线、共烧性和前所未有的现场可靠性。
导体允许多种不同的互连策略，从 25 微米金线键合到大规格铝线键合、楔形键合、带状键合、球栅阵列 (BGA)、倒装芯片等。
其他好处包括低噪音特性（比传统系统好五倍）、改进的激光后微调稳定性（提高了三倍）以及在高温下的出色耐用性。
导电/电阻水活性油墨
新兴的 PE-Kapton™ 油墨
新兴的 PE-Kapton™ 墨水正在通过这个墨水系列来提高热度，该系列为极端高温和振动是常态的应用提供了极端的通用性和热性能。设计师一直依赖 Kapton 薄膜，因为它能够在最恶劣的条件下保持其独特的机械和电气性能组合。现在，杜邦将这些功能引入了一系列导电和绝缘电子墨水。
杜邦提供广泛的混合电路材料选择，以满足不同基板、操作环境、温度和金属化的要求。杜邦的导体材料有多种传统的厚膜成分，包括银、金、铂及其合金。
自限加热器
新的启用正温度系数 (PTC) 墨水技术
由于电阻随温度升高而增加的大的自调节/自限制
提高稳定性
无需预处理
广泛的兼容粘合剂
银/铂导体
杜邦 Ag/Pt 导体提供高抗焊料浸出性和良好的焊接性能。
金基导体
金导体由于其低电阻率、即使在恶劣环境中也能抵抗金属迁移以及非氧化和腐蚀特性而用于高可靠性应用。
银/钯导体
杜邦银钯导体可限制恶劣环境中的银迁移并提高可焊性。
铂金导体
DuPont Platinium 导体适合在高温下工作，并可用作传感器应用的电极。

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