DuPont ME902银胶

产品描述 杜邦™ME902是杜邦开发的用于开发的材料套件的一部分 模内电子应用。 ME902是导电的 用于模版印刷和注射器分配的粘合剂系统 应用程序。其独特的配方可提供良好的附着力 热固化后的SMD组件和杜邦银导电胶。 杜邦™ME902干燥后仍保持一定的柔韧性，可实现 在薄基板上处理和热成型IME电路。它 包覆成型后保持其特性。 产品优点 •一部分导电胶 •对于IME应用具有良好的附着力和柔韧性 •热成型和包覆成型后的优异性能 •通过模版印刷或注射器分配进行涂覆 处理方式 基材 杜邦在聚碳酸酯或表面处理过的聚酯上的银浆 应用设备兼容性* •台式或机器人EFD流体分配系统 •模版印刷 •丝网印刷（需要稀释） *《 ME902工艺指南》中的其他信息

我司供应DuPont™ ME902，DuPont™ ME602，DuPont™ ME778，可拉伸透明导电油等膜内电子专用导电材料，如有需要请致电13922125860

PRODUCT DESCRIPTION DuPont™ ME902 is a part of the DuPont suite of materials developed for In-Mold Electronic applications. ME902 is an electrically conductive adhesive system for use in stencil-printing and syringe-dispensing applications. Its unique formulation provides good adhesion between SMD components and DuPont silver conductive pastes after heat curing. DuPont™ ME902 maintains some flexibility after drying, which enables handling & thermoforming of IME circuits on thin substrates. It maintains its properties after over-molding. PRODUCT BENEFITS • One part electrically conductive adhesive • Good adhesion with flexibility for IME applications • Excellent performance after thermoforming & over-molding • Apply via stencil-printing or syringe-dispensing PROCESSING Substrates DuPont silver pastes on polycarbonate or surface-treated polyester Application Equipment Compatibility* • EFD Fluid Dispensing Systems, bench-top or robotic • Stencil-printing • Screen-printing (thinning is required) *Additional information in ME902 Process Guide