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丰罗E-Solder 3022双组分常温固化银胶
Typical applications of E-Solder 3022 are lead terminations, printed circuits and shielding on bases which will not withstand the elevated temperatures required for fired-on coatings or solders. E-Solder 3022 is an epoxy silver paste recommended for applications requiring low electrical resistance and good adhesive properties. E-Solder 3022 requires the addition of Hardener No. 18 to harden and cure. E-Solder 3022 may be cured at room temperature, however the application of heat will accelerate and shorten the cure time
常温固化银胶
E-Solder 3022 的典型应用是引线端接、印刷电路和底座上的屏蔽，它们不能承受烧制涂层或焊料所需的高温。E-Solder 3022 是一种环氧银浆，推荐用于需要低电阻和良好粘合性能的应用。E-Solder 3022 需要添加 18 号硬化剂来硬化和固化。E-Solder 3022 可在室温下固化，但加热会加速并缩短固化时间.
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