Bondline 半导体、医疗级材料

Bondline supplies high quality performance epoxy adhesives to companies in the semiconductor, medical device, microelectronic, and aerospace industries.
Bondline manufactures cutting-edge specialty adhesive materials that solve complex problems.
1：Medical Grade Adhesives
We manufacture medical grade adhesives including USP Class VI compliant, catheter assembly, sterile disposables, transducer assembly, diagnostic equipment, needle assembly, ultrasound, optically clear other medical electronics.
2：Packaging Adhesives
Adhesives meeting CSP requirements as a manufacturer and Supplier of Reliable and High Performance Film and Paste Adhesives, Compliant and Low Outgassing Adhesives, Thermal Dissipation (Management) Adhesives, Die Attach Adhesives, Underfill Adhesives, Interposer Adhesives
3：Electronic Grade Adhesives

Bondline 为半导体、医疗设备、微电子和航空航天行业的公司提供高质量的环氧树脂粘合剂。

Bondline 生产解决复杂问题的尖端特种粘合剂材料。 1：医用级胶粘剂 我们生产医疗级粘合剂，包括符合 USP VI 类标准的导管组件、无菌一次性用品、换能器组件、诊断设备、针头组件、超声波、光学透明其他医疗电子产品。 2：包装胶 作为可靠和高性能薄膜和糊状粘合剂、合规和低释气粘合剂、散热（管理）粘合剂、芯片连接粘合剂、底部填充粘合剂、中介层粘合剂的制造商和供应商，粘合剂满足 CSP 要求 3：电子级胶粘剂 我们生产电子级粘合剂，包括芯片贴装、SMT、散热器、底部填充、封装。

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